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On the bending strength of single-crystal silicon theta-like specimens

Published

Author(s)

Rebecca R. Kirkpatrick, William Alexander Osborn, Michael S. Gaither, Richard S. Gates, Frank W. DelRio, Robert F. Cook

Abstract

A new theta geometry was developed for micro-scale bending strength measurements. The new "gap" theta specimen was a simple modification of the arch theta specimen that enabled micro-scale tensile testing. The gap theta was demonstrated here on single-crystal silicon specimens microfabricated using two different etch processes. The resulting gap theta strengths were described by three-parameter Weibull distributions derived from parameters determined from the arch theta strengths, assuming a specimen-geometry and -size invariant flaw distribution and an approximate loading configuration.
Citation
Journal of the Materials Research Society

Keywords

Finite element methods, fracture strength, microelectromechanical systems, single-crystal silicon, Weibull statistics

Citation

Kirkpatrick, R. , Osborn, W. , Gaither, M. , Gates, R. , DelRio, F. and Cook, R. (2013), On the bending strength of single-crystal silicon theta-like specimens, Journal of the Materials Research Society (Accessed April 24, 2024)
Created July 9, 2013, Updated October 12, 2021