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Argon-Ion Treatment of Multi-Material Layered Surface-Electrode Traps for Noise Mitigation

Published

Author(s)

Dustin Hite, Tobias Schaetz, Deviprasath Palani, Florian Haße, Philip Kiefer, Frederick Böckling, Daniel Stick, Ulrich Warring

Abstract

Electric-field noise near ion-trap electrodes limits motional coherence and represents a key obstacle to scaling trapped-ion quantum systems. Here, we investigate how in situ Ar+ sputtering modifies motional heating and dephasing in multi-material surface-electrode traps. Trapped ions serve as local probes of electric-field fluctuations before and after controlled sputtering cycles. The data reveal a non-monotonic dependence of both the dephasing rate and the electric-field noise on the extent of Ar+ sputtering, with coherence initially improving while heating rates increase, followed by a reversal at longer exposures. This behavior highlights the intricate balance between beneficial surface cleaning and detrimental structural modification, driven by changes in surface morphology, redeposition of sputtered material, and diffusion on the surface, underscoring the complex interplay between surface composition and motional stability in multi-material electrode systems. Post-treatment scanning electron microscopy and energy-dispersive X-ray spectroscopy confirm significant modification of the multilayer structure. Technical noise was independently verified to be well below the observed levels. These findings indicate that in situ sputtering modifies surface properties in ways that can either mitigate or enhance electric-field noise, underscoring the need for precise control of material interfaces in next-generation ion-trap architectures.
Citation
Entropy

Keywords

Ion trap technology , Atomic and Molecular Physics , Quantum Sensing , Surface Science

Citation

Hite, D. , Schaetz, T. , Palani, D. , Haße, F. , Kiefer, P. , Böckling, F. , Stick, D. and Warring, U. (2025), Argon-Ion Treatment of Multi-Material Layered Surface-Electrode Traps for Noise Mitigation, Entropy, [online], https://doi.org/10.3390/e27121208, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=960826 (Accessed February 21, 2026)

Issues

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Created November 28, 2025, Updated February 19, 2026
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