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PUBLICATIONS

APPLICATIONS OF HIGH-THROUGHPUT SCREENING TOOLS FOR THERMOELECTRIC MATERIALS

Published

Author(s)

Winnie K. Wong-Ng, Howard L. Joress, Joshua B. Martin, Yonggao Y. Yan, Jihui Yang, Makoto Otani, Evan L. Thomas, Martin L. Green, Jason Hattrick-Simpers

Abstract

The increased research and development on thermoelectric materials in recent years has been driven primarily by the need for improved efficiency in the global utilization of energy resources. To facilitate the search for new thermoelectric materials, we have developed a high-throughput thermoelectric screening system for combinatorial thin films. This screening system is comprised of two tools, one for measuring the Seebeck coefficient and resistance via an automated multiprobe apparatus, and another for measuring thermal effusivity by a frequency domain thermoreflectance technique. Using these systems, we are able to make measurements for calculating the thermoelectric power factor (S2/p,where S = Seebeck coefficient, p = electrical resistivity) and thermal conductivity of over 1000 sample-points within 6 hours for each instrument. This paper provides examples of our current studies on both oxide and intermetallic materials.
Proceedings Title
Dielectric Ceramic materials and Electronic Devices
Volume
226
Conference Dates
October 17-21, 2010
Conference Location
Houston , TX
Conference Title
Materials Science and Technology Conference (MS&T 2010)
Pub Type
Conferences

Download Paper

https://doi.org/10.1002/9781118144480.ch12.
Local Download

Keywords

Thermoelectric materials, Composition spread combinatorial films, High-throughput screening tools, Thermal power screening, Thermoeffusivity screening.
Energy

Citation

Wong-Ng, W. , Joress, H. , Martin, J. , Yan, Y. , Yang, J. , Otani, M. , Thomas, E. , Green, M. and Hattrick-Simpers, J. (2011), APPLICATIONS OF HIGH-THROUGHPUT SCREENING TOOLS FOR THERMOELECTRIC MATERIALS, Dielectric Ceramic materials and Electronic Devices, Houston , TX, [online], https://doi.org/10.1002/9781118144480.ch12. (Accessed October 21, 2025)

Issues

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Created June 21, 2011, Updated April 25, 2020
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