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Application of Compact Model Methodologies to Natural Convection Cooling of an Array of Electronic Packages in a Low Profile Enclosure

Published

Author(s)

V. H. Adams, Yogendra K. Joshi, David L. Blackburn
Proceedings Title
Proc., ASME International Intersociety Electronic and Photonic Packaging Conference
Issue
158
Conference Dates
June 15-19, 1997
Conference Location
Kohala, HI, USA

Citation

Adams, V. , Joshi, Y. and Blackburn, D. (1997), Application of Compact Model Methodologies to Natural Convection Cooling of an Array of Electronic Packages in a Low Profile Enclosure, Proc., ASME International Intersociety Electronic and Photonic Packaging Conference, Kohala, HI, USA (Accessed May 24, 2024)

Issues

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Created May 31, 1997, Updated October 12, 2021