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PUBLICATIONS

Application of Compact Model Methodologies to Natural Convection Cooling of an Array of Electronic Packages in a Low Profile Enclosure

Published

Author(s)

V. H. Adams, Yogendra K. Joshi, David L. Blackburn
Proceedings Title
Proc., ASME International Intersociety Electronic and Photonic Packaging Conference
Issue
158
Conference Dates
June 15-19, 1997
Conference Location
Kohala, HI, USA
Pub Type
Conferences

Citation

Adams, V. , Joshi, Y. and Blackburn, D. (1997), Application of Compact Model Methodologies to Natural Convection Cooling of an Array of Electronic Packages in a Low Profile Enclosure, Proc., ASME International Intersociety Electronic and Photonic Packaging Conference, Kohala, HI, USA (Accessed October 22, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created May 31, 1997, Updated October 12, 2021
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