NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

PUBLICATIONS

Apparatus to Measure Wafer Curvature for Multilayer Systems in a Vacuum Furnace

Published

Author(s)

A B. Mann, J Tapson, D van Heerden, A C. Lewis, Daniel Josell, Timothy P. Weihs

Abstract

A laser-based technique for measuring the curvature of a multilayer/substrate couple is described. Unlike most wafer curvature systems, the instrument described measures the local curvature of the multilayer/substrate couple, correcting for the local topography of the substate, rather than measuring changes in the average curvature of the multilayer/substrate couple. The apparatus has been designed specifically to perform biaxial zero-creep measurements at elevated temperatures in vacuum. It can also be used to examine the development of biaxial stresses during thermal cycling of thin films deposited on substrates.
Citation
Review of Scientific Instruments
Volume
73
Issue
No. 4
Pub Type
Journals

Keywords

curvature, multilayer, stress, thin film

Citation

Mann, A. , Tapson, J. , van Heerden, D. , Lewis, A. , Josell, D. and Weihs, T. (2002), Apparatus to Measure Wafer Curvature for Multilayer Systems in a Vacuum Furnace, Review of Scientific Instruments (Accessed October 10, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created March 31, 2002, Updated October 12, 2021
Was this page helpful?