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Sei-Hyung Ryu, Sumi Krishnaswami, Michael O'Loughlin, James Richmond, Anant Agarwal, John W. Palmour, Allen R. Hefner Jr.
Abstract
10 kV, 123 mΩ}-cm2 Power DMOSFETs in 4H-SiC are demonstrated. A 42% reduction in Ron,sp, compared to previously reported value, was achieved by using an 8 x 1014 cm-3 doped, 85 υm thick drift epilayer. An effective channel mobility of 22 cm2/Vs was measured from a test MOSFET. A specific on-resistance of 123 mΩ}-cm2 were measured with a gate bias of 18 V, which corresponds to an Eox of 3 MV/cm. A leakage current of 197 υA was measured at a drain bias of 10 kV from a 4H-SiC DMOSFET with an active area of 4.24 x 10-3 cm2. A switching time of 100 ns was measured in 4.6 kV, 1.3 A switching measurements. This shows that the 4H-SiC power DMOSFETS are ideal for high voltage, high speed switching applications.
high voltage, MOSFET, power device, semiconductor, Silicon-carbide, wide-bandgap
Citation
Ryu, S.
, Krishnaswami, S.
, O'Loughlin, M.
, Richmond, J.
, Agarwal, A.
, Palmour, J.
and Hefner Jr., A.
(2004),
10 kV, 123 m {Ω}-cm<sup>2</sup> 4H-SiC Power DMOSFETs, IEEE Electron Device Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31865
(Accessed October 16, 2025)