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Maureen E. Williams (Fed)

My research is focused on Sn whiskers. I am currently the project leader of the NIST Sn Whisker Project. This project is working on the fundamental growth mechanism of Sn whiskers.

Since 1999 I have been involved in the International Electronics Manufacturing Initiative (iNEMI) Sn whisker projects and from 2001 until 2007 was co-chair of the iNEMI Sn Whisker Modeling Group.  In 2009 I represented NIST on a team of sixteen nationally-recognized expert scientists and engineers on Phases 1 & 2 of the Lead Free Electronics Manhattan Project (LFMP), sponsored by the Office of Naval Research and the Joint Defense Manufacturing Technology Panel, to address the serious reliability threat from lead-free solders and surface finishes that are infiltrating critical aerospace and defense systems. The third phase of the LFMP project, re-named the Lead-free Electronics Risk Reduction Program, has articulated eighty research and development (R&D) tasks needed to address the lead-free technology knowledge gaps and funding is being sought to implement this R&D program.  My areas of interest include scanning electron microscopy (SEM), Focused Ion Beam (FIB), and x-ray diffraction.


Selected Publications

Equi-Axed Grain Formation in Electrodeposited Sn-Bi

E Sandnes, Maureen E. Williams, Mark D. Vaudin, Gery R. Stafford
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity and corrosion

Whisker & Hillock Formation on Sn, Sn-Cu and Sn-Pb Electrodeposits

William J. Boettinger, C E. Johnson, Leonid A. Bendersky, Kil-Won Moon, Maureen E. Williams, Gery R. Stafford
Bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 mm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus. Over a period of


JARVIS-Leaderboard: A Large Scale Benchmark of Materials Design Methods

Kamal Choudhary, Daniel Wines, Kevin Garrity, aldo romero, Jaron Krogel, Kayahan Saritas, Panchapakesan Ganesh, Paul Kent, Pascal Friederich, Vishu Gupta, Ankit Agrawal, Pratyush Tiwary, ichiro takeuchi, Robert Wexler, Arun Kumar Mannodi-Kanakkithodi, Avanish Mishra, Kangming Li, Adam Biacchi, Francesca Tavazza, Ben Blaiszik, Jason Hattrick-Simpers, Maureen E. Williams
Reproducibility and validation are major hurdles for scientific development across many fields. Materials science in particular encompasses a variety of

Robust Bottom-Up Gold Filling of Deep Trenches and Gratings

Daniel Josell, William Alexander Osborn, Maureen E. Williams
This work extends application of an extreme variant of superconformal Au electrodeposition to deeper device architectures while exploring factors that constrain
Created October 9, 2019, Updated December 8, 2022