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David A LaVan (Fed)

Program Manager

David A. LaVan is a Program Manager in the CHIPS National Advanced Packaging Manufacturing Program (NAPMP).  Before joining CHIPS, he was a group leader in the Material Measurement Laboratory at NIST and has worked on the measurement of thermal and mechanical properties of thin films and devices for almost 30 years.  He received his B.S. in Materials Science and Engineering from the University of Florida and his Ph.D. in Mechanical Engineering from the Johns Hopkins University; he was a Postdoctoral Fellow at Sandia National Labs and then in the joint MIT and Harvard HST Program.  He was a Co-Chair for the 2018 Fall MRS Meeting and Chair for the 2023 NATAS Meeting.  He was named to the National Academies Frontiers of Engineering in 2006 and awarded a Department of Commerce Bronze Medal in 2018. 


  • U.S. Department of Commerce Bronze Medal Award 2018
  • Keck Futures Initiative on Synthetic Biology 2009
  • U.S. National Academy of Engineering, Frontiers of Engineering, 2006
  • Keck Futures Initiative on Nanoscience and Nanotechnology, 2004
  • 'Spot' Recognition Award, Sandia National Laboratories, 1999
  • First Place, Society for Experimental Mechanics Student Paper Competition, 1997


Polyethyleneimine/polyethylene glycol–conjugated gold nanoparticles as nanoscale positive/negative controls in nanotoxicology: Testing in frog embryo teratogenesis assay–Xenopus and mammalian tissue culture system

Vytas Reipa, Alessandro Tona, Feng Yi, Bryant C. Nelson, David A. LaVan, Vincent A. Hackley, Tae Joon Cho
Despite the great potential of using positively charged gold nanoparticles (AuNPs) in nanomedicine, no systematic studies have been reported on their synthesis

Growth and Decomposition of Pt Surface Oxides

Feng Yi, Shane Arlington, Justin Gorham, William Alexander Osborn, Slavomir Nemsak, Ethan Crumlin, David A. LaVan
The formation and thermal stability of Pt surface oxides on Pt thin film were studied in situ using ambient pressure x-ray photoelectron spectroscopy (AP-XPS)
Created October 9, 2019, Updated May 23, 2024