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Search Patents by Eric Stanton

Patents listed here reflect only technologies patented from FY 2018-present. To view all of NIST's patented technologies, visit the NIST pages on the Federal Laboratory Consortium website.

Displaying 1 - 5 of 5
Close-up of an emerald green circuit board highlighting the three-dimensional topography of this miniature electronic ecosystem.

Advanced Wafer Bonding for High-Density Semiconductor Integration

NIST Inventors
Eric Stanton and Nima Nader
This invention is a new method for bonding different types of computer wafers called "heterogeneous integration," which allows multiple materials and components to be combined into a single, more advanced electronic device. This invention creates matching pockets in new wafers to fit over existing

Quantum Waveguide Infrared Photodetector

NIST Inventors
Eric Stanton
A novel quantum well infrared photodetector (QWIP) is proposed, which provides an unprecedented signal-to-noise ratio compared any other infrared detector. The key feature is the ability to inject light in the absorbing regions in the plane of the detector material layers, rather than surface normal

Quantum Waveguide Infrared Photodetector

NIST Inventors
Eric Stanton
A novel quantum well infrared photodetector (QWIP) is proposed, which provides an unprecedented signal-to-noise ratio compared any other infrared detector. The key feature is the ability to inject light in the absorbing regions in the plane of the detector material layers, rather than surface normal
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