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https://www.nist.gov/patents/inventors/1172981
Search Patents by Nima Nader
Patents listed here reflect only technologies patented from FY 2018-present. To view all of NIST's patented technologies, visit the NIST pages on the Federal Laboratory Consortium website.
This invention is a new method for bonding different types of computer wafers called "heterogeneous integration," which allows multiple materials and components to be combined into a single, more advanced electronic device. This invention creates matching pockets in new wafers to fit over existing