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Search Patents by Nima Nader

Patents listed here reflect only technologies patented from FY 2018-present. To view all of NIST's patented technologies, visit the NIST pages on the Federal Laboratory Consortium website.

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Close-up of an emerald green circuit board highlighting the three-dimensional topography of this miniature electronic ecosystem.

Advanced Wafer Bonding for High-Density Semiconductor Integration

NIST Inventors

Eric Stanton and Nima Nader

This invention is a new method for bonding different types of computer wafers called "heterogeneous integration," which allows multiple materials and components to be combined into a single, more advanced electronic device. This invention creates matching pockets in new wafers to fit over existing

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