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PUBLICATIONS

What is the Future for Technology Roadmaps on Optoelectronics Packaging

Published

Author(s)

Herbert S. Bennett

Abstract

Reasons for why you should become more involved with technology roadmaps for optoelectronics packaging are given. Unlike the silicon CMOS (complementary metal-oxide semiconductor) industry, the optoelectronics packaging industry does not have an international consensus for a few selected applications to set priorities for shared investments in pre-competitive research and technology development and deployment. The main purpose of this paper is to increase the awareness among industrial decision-makers about the need for an international consensus or technology roadmap concerning selected areas of optoelectronics packaging. The technical challenges presented by optical interconnects for microelectronics is one application from among many for which technology roadmaps for optoelectronic packaging would be appropriate and could lead to making optoelectronics packaging a mainstream industry as the Si CMOS industry is today.
Proceedings Title
Proc., International Workshop on Optoelectronics Packaging and Micro-Optoelectromechanical System (MOEMS)
Conference Dates
October 8-11, 2002
Conference Location
Bethlehem, PA
Conference Title
Topical Workshop on Optoelectronic Packaging and Micro-Optoelectromechanical Systems (MOEMS)
Pub Type
Conferences

Citation

Bennett, H. (2003), What is the Future for Technology Roadmaps on Optoelectronics Packaging, Proc., International Workshop on Optoelectronics Packaging and Micro-Optoelectromechanical System (MOEMS), Bethlehem, PA (Accessed October 11, 2025)

Issues

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Created October 11, 2003, Updated February 17, 2017
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