Accelerator Aging Effects During Copper Electrodeposition

Published

April 1, 2003

Author(s)

Thomas P. Moffat, B C. Baker, Daniel Wheeler, Daniel Josell

Abstract

Slow sweep rate voltammetric analysis of the Cu/Cu(II) deposition reaction is shown to be an effective tool for examining aging effects associated with thiol and disulfide additives that are widely employed as brighteners. Sulfonate-terminated short chain thiols are sponstaneiously oxidized by Cu(II) toform disulfide molecules with the conversion being complete within a few hours of electrolyte preparation. An additional aging effect occurs during electrolysis in conventional un-separated electrochemical cells. At the anode, the disulfide is reduced by Cu(I) forming thiolate cpmplexes which subsequently affect the copper deposition reaction occuring at the cathode. The latter effect may be avoided by using a cation selective membrane to isolate the anode compartment.

Citation

Electrochemical and Solid State Letters

Volume

6 No. 4

Pub Type

Journals

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Keywords

cathode, copper, sulfonate

Citation

Moffat, T. , Baker, B. , Wheeler, D. and Josell, D. (2003), Accelerator Aging Effects During Copper Electrodeposition, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853226 (Accessed October 18, 2025)