Chuang, T.
and Lee, S.
(2000),
Elastic Flexure of Bilayered Beams Subject to Strain Differentials, Journal of Materials Research
(Accessed December 7, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Elastic Flexure of Bilayered Beams Subject to Strain Differentials
Published
Author(s)
Tze J. Chuang, S K. Lee
Abstract
The residual stresses present in a thin film and the curvatures formed at its substyrate during deposition have been a great concern to electrochemists and process engineers. Here a new hybrid analytical method is presented to reanalyze the flexural problem subjected to a strain differential in the general case. It was shown that the present solutions for ultrathin films agree with Stoney's equation. Moreover, single or dual neutral axes resulted, depending on materials and thickness rations between the film and the substrate. Quantitative differences with others in the solutions of deformed curvature and residual stress are discussed in a representative case of GaAs top coat/Si substrate wafers.Citation
Journal of Materials Research
Volume
15
Issue
No. 12
Pub Type
Journals
Keywords
bilayered beams, bilayered plates, elastic bending, inhomogeneous layered media, residual stress, semiconductor wafers, surface engineering, thermal expansion mismatch, two-phase composites
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created December 1, 2000, Updated June 2, 2021