NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

PUBLICATIONS

Database for Solder Properties With Emphasis on New Lead-Free Solders

Published

Author(s)

David R. Smith, Thomas A. Siewert, L Stephen, Juan C. Madeni

Abstract

Legal and environmental considerations require that the electronics industries cease using solders containing lead. This database provides properties of lead-free solders that may be used to replace the solders containing lead that are currently in use. More data will be added to this database at regular intervels, as they become available.
Citation
Electronic Publication
Pub Weblink
Pub Type
Websites

Keywords

alloys, bibliography, electrical, lead-free, mechanical, physical, properties, solder, thermal

Citation

Smith, D. , Siewert, T. , Stephen, L. and Madeni, J. (2002), Database for Solder Properties With Emphasis on New Lead-Free Solders, Electronic Publication, [online], None (Accessed October 7, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created December 31, 2001, Updated October 12, 2021
Was this page helpful?