Strain Measurements in Thermally-Loaded Circuit Boards Containing Embedded Resistors

Published

May 1, 2002

Author(s)

Elizabeth S. Drexler, R C. Snogren, M C. Snogren, J J. Felten, P A. Green

Abstract

Four specimens of embedded resistors were tested from room temperature to the processingtemperature (177 C) to compare deformations in the printed wiring board (PWB) using electron-beam moire. The specimens had different termination sizes and geometries; two with straight approaches to the termination came from one board and three with indirect approaches camefrom a second board. In none of the specimens did deformation occur in the embedded resistoror at the interface between the resistor and the termination. However, significant deformationoccurred within the PWB and the laser barrier of the specimens with the indirect approach to thetermination. Strains as high as 6% were calculated in areas of that PWB. And in one specimen,the thermal expansion mismatch between the resistor and the laser barrier was so great that a crack developed at that interface.

Proceedings Title

Electronic Components and Technology Conference | 52 | | IEEE

Volume

2002

Issue

52nd

Conference Dates

May 1, 2002

Conference Title

IEEE Electronic Components and Technology Conference

Pub Type

Conferences

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Keywords

displacement, electron-beam moire, embedded passives, lanthanum hexaboride, printed wiring board, resistor, strain

Citation

Drexler, E. , Snogren, R. , Snogren, M. , Felten, J. and Green, P. (2002), Strain Measurements in Thermally-Loaded Circuit Boards Containing Embedded Resistors, Electronic Components and Technology Conference | 52 | | IEEE, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851253 (Accessed October 17, 2025)