High-Throughput Measurements of Polymer Adhesion and Mechanical Properties

Published

September 1, 2003

Author(s)

Christopher Stafford, Aaron M. Forster, C Harrison, Cher H. Davis, Eric J. Amis, Alamgir Karim

Abstract

Polymer adhesion is important to numerous technologies including electronic packaging, coatings and paints, biomedical implants, and pressure-sensitive adhesives. The challenge is to understand the fundamental driving forces for the development of adhesive strength at polymer - polymer, metal, ceramic, and biomaterial interfaces in multivariable environments. Current methods for characterizing adhesion with combinatorial methodologies are challenged by both experimental geometry and throughput issues. In response to this, we describe a methodology for quantitatively measuring the adhesive strength of polymer interfaces in a combinatorial manner. Likewise, we describe a simple, robust, and flexible measurement technique for the mechanical properties of thin polymer films. These combinatorial techniques are aimed to benefit the coating, semiconductor, and optical adhesives industry.

Citation

Abstracts Of Papers Of The American Chemical Society

Volume

226

Pub Type

Journals

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Keywords

adhesion mechanical properties, combinatorial methods, gradient libraries, high-throughput experimentation, polymer thin films

Citation

Stafford, C. , Forster, A. , Harrison, C. , Davis, C. , Amis, E. and Karim, A. (2003), High-Throughput Measurements of Polymer Adhesion and Mechanical Properties, Abstracts Of Papers Of The American Chemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852176 (Accessed October 10, 2025)