The physics package for a chip-scale atomic frequency reference was constructed and tested. The device has a total volume of 9.5 mm3, dissipates 75 mW of electrical power at an ambient temperature of 45 °C and has a short-term fractional frequency instability of 2.4×10-10/√υ. Advanced cell fabrication techniques indicate a long-term instability near 1-^-11^ may be feasible.
Conference Location: Besancon, FR
Conference Title: 19th European Frequency and Time Forum
Pub Type: Conferences
Atomic, clock, compact, microfabrication, wafer bonding