The rising interest in lead-free solders creates a need for complete property data on the various lead-free solder compositions. Circuit designers need these data to assess the impact of the transition on product life, and production engineers need these data to determine processing parameters. Various types of data are available, but are widely dispersed through the literature. To improve the sharing of this important information, we developed an on-line database for solder properties emphasizing new lead-free solders. One problem with combining data from many sources was that variations in test procedures led to undesirable scatter.
Citation: Welding Journal
Pub Type: Journals
copper, intemetallics, lead-free solders, silver, solder, tin