Shih, A.
, Gao, W.
, Vogl, G.
, Djurdjanovic, D.
, Fukushima, T.
and Malshe, A.
(2026),
Innovations in advanced processes and systems for semiconductor manufacturing, CIRP Annals-Manufacturing Technology, [online], https://doi.org/10.1016/j.cirp.2026.04.115, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=961532 (Accessed July 22, 2026)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Innovations in advanced processes and systems for semiconductor manufacturing
Published
Author(s)
Albert Shih, Wei Gao, , Dragan Djurdjanovic, Takafumi Fukushima, Ajay Malshe
Abstract
The manufacturing of integrated circuits (ICs) is an enabler of technological innovation and is critical to the resilience of industry and national security. Four levels of excellence are necessary as the foundation for semiconductor manufacturing: ecosystem; fab profitability; IC design for manufacturing and research & development; culture and customer trust. In this paper, the culture, semiconductor manufacturing processes, innovations of equipment, removal processes, in-line metrology for process control, and data analytics are discussed. Future topics, including advanced packaging, sustainability, fab operation optimization, and in-space semiconductor manufacturing, as well as work force policy and ethics, are elaborated.Citation
CIRP Annals-Manufacturing Technology
Volume
75
Issue
2
Pub Type
Journals
Download Paper
Keywords
Semiconductor manufacturing, Integrated circuits, In-line metrology, Process control, Data analytics, Advanced packaging
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created June 30, 2026, Updated July 21, 2026