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PUBLICATIONS

Testing dielectric slab mode excitation, non-rectangular conductor profiles and edge roughness as sources of additional loss in mmWave transmission lines

Published

Author(s)

Florian Bergmann, Nicholas Jungwirth, Bryan Bosworth, Jason Killgore, Eric Marksz, Tomasz Karpisz, Meagan Papac, Anna Osella, Lucas Enright, Christian Long, Nathan Orloff

Abstract

Losses in mmWave transmission lines often exceed first-principles predictions based on measurements of dc resistivity and the nominal conductor geometry. In our case, we observed an additional distributed resistance of coplanar waveguides on DyScO3 substrates. Here, we test three hypotheses on the additional resistance: radiation, non-rectangular conductor profiles, and conductor edge roughness. We present measurements on metallic and dielectric chucks to test radiation and atomic force microscopy measurements of the conductor to test non-rectangular conductor profiles and edge roughness. Our findings suggest that none of the above approaches is sufficient by themselves to explain the observed additional resistance. Still, we expect our findings to impact industrial processes especially when considering the trend from stepper lithography to microlens array (MLA) lithography for rapid prototyping and multiproject wafers.
Proceedings Title
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023
Conference Dates
June 11-16, 2023
Conference Location
San Diego, CA, US
Pub Type
Conferences

Download Paper

https://doi.org/10.1109/IMS37964.2023.10188190
Local Download
Radiation, Materials characterization and Electromagnetics

Citation

Bergmann, F. , Jungwirth, N. , Bosworth, B. , Killgore, J. , Marksz, E. , Karpisz, T. , Papac, M. , Osella, A. , Enright, L. , Long, C. and Orloff, N. (2023), Testing dielectric slab mode excitation, non-rectangular conductor profiles and edge roughness as sources of additional loss in mmWave transmission lines, 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023, San Diego, CA, US, [online], https://doi.org/10.1109/IMS37964.2023.10188190, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936317 (Accessed October 28, 2025)

Issues

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Created July 28, 2023, Updated December 11, 2024
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