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Thomas H. Gnaupel-Herold (Fed)

Publications

Bottom-up Au Filling of Trenches in Curved Wafers

Author(s)
Daniel Josell, Thomas P. Moffat, Thomas Gnaupel-Herold, David Raciti, Martin Stauber, Yu Q, Liyang Chen, M Rawlik, Marco Stampanoni, Lucia Romano
A 〖Bi〗^(3+)-stimulated Au electrodeposition process in slightly alkaline 〖Na〗_3 Au(〖SO〗_3 )_2+〖Na〗_2 〖SO〗_3 electrolytes has been previously demonstrated for
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Data and Software Publications

AM Bench 2022 Residual Elastic Strain, Residual Stress, and Part Deflection Measurements for IN718 3D Builds

Author(s)
Lyle Levine, Thien Phan, M. Hazar Șeren, Maxwell Praniewicz, Christopher D'Elia, Thomas Gnaupel-Herold, Kelly Nygren, J.Y. Peter Ko, Katherine Shanks, Nicholas Bachus, Jason Fox, Jared Tarr, Darren Pagan, Michael Hill
The following data files include residual elastic strain, residual stress, and part deflection results associated with the 2022 Additive Manufacturing Benchmark test series (AM Bench 2022) AMB2022-01
Created October 9, 2019, Updated December 8, 2022
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