Awarded for achievements in science and engineering. The group is recognized for the development and deployment of a new dimensional-metrology method to solve a critical challenge for the semiconductor industry. The new method, Critical Dimension Small Angle X-Ray Scattering (CD-SAXS), measures the shape of the three-dimensional nanostructures in semiconductor devices non-destructively, directly on production wafers at length scales needed to advance technology. Through close partnership with industry, CD-SAXS has now been actively adopted across the industry for next-generation device manufacturing.