The group is honored for developing new X-ray scattering methods able to quantify previously unmeasurable structural details in the nanoscale features fabricated by the self-assembling lithography materials under active development by the semiconductor industry. These methods are being adopted by research groups around the world because of the methods' ability to resolve both the structural details (shape) and molecular orientation within these nanoscale polymeric features. This detailed molecular-level understanding of the self-assembly process provides details needed to validate computational materials simulations used by the semiconductor industry to develop and control this new class of lithographic patterning materials.