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EVENTS

CHIPS for America NAPMP NOFO – Materials and Substrates

Name: CHIPS for America NAPMP NOFO – Materials and Substrates
Start: 2024-03-01T15:00:00-05:00
End: 2024-03-01T15:00:00-05:00

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

This webinar reviews in detail the CHIPS for America National Advanced Packaging Manufacturing Program (NAPMP) notice of funding opportunity for materials and substrates with Dan Berger and Aaron Forster.

Electronics, Energy and Manufacturing

Created February 23, 2024, Updated February 28, 2024