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Projects/Programs: Grand Challenge 6 :Standardizing New Materials, Processes, and Equipment for Microelectronics

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Thin film RGTM, both whole sister wafer and diced wafers for NIST Measurement

Nanometer-Scale Planar Reference Materials

Ongoing
In most industrial fabs today, foundry test artifacts (wafers) are used to test metrology tools and monitor process stability. These wafers are made in partnerships between specific materials providers and metrology tool providers and may have limited or no adoption across foundries. In some
Microscopy standard linking critical dimensions of line-space arrays and frustum arrays of varying pitch, for hybrid metrology by optical microscopy, scanning electron microscopy,atomic force microscopy, and the NIST line-scale interferometer

Universal Microscopy Standards

Ongoing
Microscopy standards that are available today have inadequate performance characteristics. As device linewidths decrease toward physical limits, the international roadmap of devices and systems (IRDS) has set uncertainty targets by the year 2025. This target is hard to hit, challenging the industry