Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

A vacuum manifold for rapid world-to-chip connectivity of complex PDMS microdevices

Published

Author(s)

Gregory A. Cooksey, Anne L. Plant, Francisco J. Atencia

Abstract

The lack of simple interfaces for microfluidic devices with a large number of inlets significantly limits production and utilization of these devices. In this paper, we describe the fabrication of a reusable manifold that provides rapid world-to-chip connectivity. A vacuum network milled into a rigid manifold holds microdevices and prevents leakage of fluids injected into the device from ports in the manifold. A number of different manifold designs were explored, and all performed similarly, yielding an average of 97 kPa (14 psi) fluid holding pressure. The wide applicability of this manifold concept is demonstrated by interfacing with a 51-inlet microfluidic chip containing 144 chambers and hundreds of embedded pneumatic valves. Due to the speed of connectivity, the manifolds are ideal for rapid prototyping and are well suited to serve as universal interfaces.
Citation
Lab on A Chip
Volume
9
Issue
9

Citation

Cooksey, G. , Plant, A. and Atencia, F. (2009), A vacuum manifold for rapid world-to-chip connectivity of complex PDMS microdevices, Lab on A Chip, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=901151 (Accessed December 3, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created January 1, 2009, Updated February 19, 2017