A vacuum manifold for rapid world-to-chip connectivity of complex PDMS microdevices
Gregory A. Cooksey, Anne L. Plant, Francisco J. Atencia
The lack of simple interfaces for microfluidic devices with a large number of inlets significantly limits production and utilization of these devices. In this paper, we describe the fabrication of a reusable manifold that provides rapid world-to-chip connectivity. A vacuum network milled into a rigid manifold holds microdevices and prevents leakage of fluids injected into the device from ports in the manifold. A number of different manifold designs were explored, and all performed similarly, yielding an average of 97 kPa (14 psi) fluid holding pressure. The wide applicability of this manifold concept is demonstrated by interfacing with a 51-inlet microfluidic chip containing 144 chambers and hundreds of embedded pneumatic valves. Due to the speed of connectivity, the manifolds are ideal for rapid prototyping and are well suited to serve as universal interfaces.