Tomographic Reconstruction of an Integrated Circuit Interconnect
Zachary H. Levine, A R. Kalukin, S P. Frigo, I McNulty, M Kuhn
An Al-W-silica integrated circuit interconnect sample was thinned to several micro υ and scanned across a 200 nm focal spot of a Fresnel zone plate operating at photon energy of 1573 eV. The experiment was performed on beamline 2-ID-B of the Advanced Photon Source, a third-generation synchrotron facility. Thirteen scanned projections of the sample were acquired over the angular range of + 69.2 . At least 301 x 301 pixels were acquired at each angle with a step size of 77 X 57 nm. A three-dimensional image with an approximate uncertainty of 400 nm was reconstructed from projection data using a standard algorithm. The two layers of the integrated circuit and the presence of the focused ion beam markers on the surface of the sample are clearly shown in the reconstruction.