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Thermal release tape-assisted semiconductor membrane transfer process for hybrid photonic devices embedding quantum emitters

Published

Author(s)

Cori Haws, Biswarup Guha, Edgar Perez, Marcelo Davanco, Jin Dong Song, Kartik Srinivasan, Luca Sapienza

Abstract

Being able to combine different materials allows taking advantage of different properties and device engineering that cannot be found or exploited within a single system. In the realm of quantum and nanophotonics, for instance, one might want to increase the device functionalities by combining efficient classical and quantum light emission available in III-V semiconductors, low-loss light propagation accessible in silicon-based materials, fast electro-optical properties of lithium niobate and broadband reflectors and/or buried metallic contacts for local electric field application or electrical injection of emitters. However, a combined growth or deposition of different materials on the same wafer can be challenging, given crystallographic requirements and strain considerations that can result in low reproducibility and/or low yield in the growth or wafer-bonding processes. We propose a technique, that is versatile, given that it poses limited restrictions on the transferred and host materials (namely, the ability to create free-standing membranes in the former), based on the removal of arrays of free-standing membranes and their deposition onto a host material, by using a thermal-release adhesive tape-assisted transfer process. In particular, we transfer 190 nm-thick GaAs membranes, with dimensions up to about 260 um x 80 um, containing InAs quantum dots, on a gold substrate. We show that the presence of a back reflector combined with the etching of micro-pillars allows to significantly increase the extraction efficiency of quantum light, reaching photon fluxes, from a single quantum dot line, exceeding 8x10^5 counts per second, four times higher than the highest count rates measured, on the same chip, from emitters outside the pillars. Given the versatility and the easy process, this technique opens the path to the realization of hybrid quantum and nanophotonic devices that can combine virtually any material that can be undercut to realize free-standing membranes that are then transferred onto any host substrate, without specifi c compatibility issues and/or requirements.
Citation
Materials for Quantum Technology
Volume
2
Issue
2

Citation

Haws, C. , Guha, B. , Perez, E. , Davanco, M. , Song, J. , Srinivasan, K. and Sapienza, L. (2022), Thermal release tape-assisted semiconductor membrane transfer process for hybrid photonic devices embedding quantum emitters, Materials for Quantum Technology, [online], https://doi.org/10.1088/2633-4356/ac603e , https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=933953 (Accessed May 21, 2024)

Issues

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Created April 19, 2022, Updated November 29, 2022