Krause, R.
and Wiederhorn, S.
(2001),
Tensile Creep Behavior of a Gas-Pressure-Sintered Silicon Nitride Containing Silicon Carbide, Journal of the American Ceramic Society
(Accessed July 15, 2025)
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Tensile Creep Behavior of a Gas-Pressure-Sintered Silicon Nitride Containing Silicon Carbide
Published
Author(s)
,
Abstract
The tensile creep behavior of a gas-pressure-sintered silicon nitride containing silicon carbide, was carbide was characterized at temperatures between 1375 and 1450 C with applied stresses between 50 and 250 Mpa. Individual specimens were tested at fixed temperatures and applied loads. Each specimen was pin-loaded within the hot zone of a split-tube furnace through silicon carbide rods connected outside the furnace to a pneumatic cylinder. The gauge length was measured by laser extensometry, using gauge markers attached to the specimen. Secondary creep rates ranged from 0.54 to 270 Gs-1, and the creep tests lasted from 6.7 to 1005 h. Exponential functions of stress and temperature were fitted to represent the secondary creep rate and the creep-lifetime. The material was found to be more creep resistant than two other silicon nitride ceramics that had been characterized earlier by the same method of measurement as viable candidates for high-temperature service.Citation
Journal of the American Ceramic Society
Volume
84
Issue
No. 10
Pub Type
Journals
Keywords
applied stress, pin-loaded specimen, silicon nitride, temperature, tensile creep
Citation
Issues
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Created October 1, 2001, Updated February 19, 2017