DeReggi, A.
, Hobbie, E.
, Bloss, P.
and Schafer, H.
(2008),
Surface-Enganced Thermal Pulse Measurements of the Thermal and Electrical Properties of Polyimide Films, Annual Report Conference on Electrical Insulation and Dielectric Phenomena, Undefined
(Accessed April 19, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Surface-Enganced Thermal Pulse Measurements of the Thermal and Electrical Properties of Polyimide Films
Published
Author(s)
, , P Bloss, H Schafer
Abstract
Polyimide films formed on silicon by spin coating and curing of foils glued to substrates generally show a sharp surface-bound negative charge layer with a half-width of 30 nm as revealed by the thermal pulse method. The origin of this stable charge, which is insenstive to applied voltages, is believed to be environmental electrochemistry involving moisture, but other mechanisms are possible. Under an applied voltage, additional charge is observed to penetrate the dielectric deeper in the bulk, consistent with injection from the substrate. Separate analysis of the two contributions to the thermal pulse signals yields both bulk and near-surface thermal properties. Preliminary measurements and analysis suggest that the near-surface diffusivity is a factor of two smaller than the bulk values.Proceedings Title
Annual Report Conference on Electrical Insulation and Dielectric Phenomena
Conference Dates
October 1, 1999
Conference Location
Undefined
Conference Title
Conference on Electrical Insulation and Dielectric Phenomena
Pub Type
Conferences
Keywords
deconvolution, polyimide, surface, thermal pulse
Citation
Created October 16, 2008