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In-situ Stress Measurements During Electrodeposition of Au-Ni Alloys
Published
Author(s)
Eric Rouya, Gery R. Stafford, Carlos R. Beauchamp, J. A. Floro, R. G. Kelly, Reed L. M., Zangari G.
Abstract
We investigate the stress evolution in-situ during the potentiostatic electrodeposition of metastable, nanostructured Au-Ni alloy films, and develop a correlation between the alloy nucleation and growth mode, the growth rate, alloy composition and the observed stress state. We find that the internal stresses during Au-Ni deposition can be explained, at least for Ni-rich films, assuming 3-D Volmer-Weber growth, where the stress is initially compressive, then transitions to tension, and finally remains tensile over longer times. The observed trends in maximum compressive stress, compressive-to-tensile transition thickness and steady-state tensile stress with alloy composition can all be related to the observed decrease in grain size with increasing Ni content. The Au-rich films however do not follow the above trends, suggesting that other stress mechanisms may be operative in this compositional range.
Rouya, E.
, Stafford, G.
, Beauchamp, C.
, Floro, J.
, Kelly, R.
, M., R.
and G., Z.
(2010),
In-situ Stress Measurements During Electrodeposition of Au-Ni Alloys, Journal of the Electrochemical Society, [online], https://doi.org/10.1149/1.3477933
(Accessed October 13, 2025)