In-situ Stress Measurements During Electrodeposition of Au-Ni Alloys

Published

September 10, 2010

Author(s)

Eric Rouya, Gery R. Stafford, Carlos R. Beauchamp, J. A. Floro, R. G. Kelly, Reed L. M., Zangari G.

Abstract

We investigate the stress evolution in-situ during the potentiostatic electrodeposition of metastable, nanostructured Au-Ni alloy films, and develop a correlation between the alloy nucleation and growth mode, the growth rate, alloy composition and the observed stress state. We find that the internal stresses during Au-Ni deposition can be explained, at least for Ni-rich films, assuming 3-D Volmer-Weber growth, where the stress is initially compressive, then transitions to tension, and finally remains tensile over longer times. The observed trends in maximum compressive stress, compressive-to-tensile transition thickness and steady-state tensile stress with alloy composition can all be related to the observed decrease in grain size with increasing Ni content. The Au-rich films however do not follow the above trends, suggesting that other stress mechanisms may be operative in this compositional range.

Citation

Journal of the Electrochemical Society

Volume

13

Issue

11

Pub Type

Journals

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DOI Link

Citation

Rouya, E. , Stafford, G. , Beauchamp, C. , Floro, J. , Kelly, R. , M., R. and G., Z. (2010), In-situ Stress Measurements During Electrodeposition of Au-Ni Alloys, Journal of the Electrochemical Society, [online], https://doi.org/10.1149/1.3477933 (Accessed December 5, 2024)