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In-situ Stress Measurements During Electrodeposition of Au-Ni Alloys



Eric Rouya, Gery R. Stafford, Carlos R. Beauchamp, J. A. Floro, R. G. Kelly, Reed L. M., Zangari G.


We investigate the stress evolution in-situ during the potentiostatic electrodeposition of metastable, nanostructured Au-Ni alloy films, and develop a correlation between the alloy nucleation and growth mode, the growth rate, alloy composition and the observed stress state. We find that the internal stresses during Au-Ni deposition can be explained, at least for Ni-rich films, assuming 3-D Volmer-Weber growth, where the stress is initially compressive, then transitions to tension, and finally remains tensile over longer times. The observed trends in maximum compressive stress, compressive-to-tensile transition thickness and steady-state tensile stress with alloy composition can all be related to the observed decrease in grain size with increasing Ni content. The Au-rich films however do not follow the above trends, suggesting that other stress mechanisms may be operative in this compositional range.
Journal of the Electrochemical Society


Rouya, E. , Stafford, G. , Beauchamp, C. , Floro, J. , Kelly, R. , M., R. and G., Z. (2010), In-situ Stress Measurements During Electrodeposition of Au-Ni Alloys, Journal of the Electrochemical Society, [online], (Accessed April 19, 2024)
Created September 9, 2010, Updated October 12, 2021