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Displaying 26 - 30 of 30

Exploring the Kinetic and Thermodynamic Relationship of Charge Transfer Reactions used in Localized Electrodeposition and Patterning in a Scanning Bipolar Cell

May 14, 2019

Author(s)

Trevor M. Braun, D. T. Schwartz

Bipolar electrochemistry, defined as simultaneous oxidation and reduction reactions occurring on an electrically floating electrode, involves intricate coupling of the ohmic drop in the electrochemical cell to the thermodynamics and kinetics of the bipolar

Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias

January 18, 2019

Author(s)

Trevor Braun, Daniel Josell, Manoj R. Silva, Thomas P. Moffat

This work examines Cu deposition in low chloride, suppressor containing electrolytes that exhibit a transition from passive to active deposition partway down filling features based on the coupling of suppression breakdown and surface topography. The

Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

May 16, 2018

Author(s)

Trevor Braun, Daniel Josell, Thomas P. Moffat, Hyo Jong Lee, SH Kim

This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO4 + NiCl2 + H3BO3 electrolyte containing a branched polyethyleneimine suppressor previously. Feature filling occurs through the coupling of transport limited

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