Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Roadmap on emerging hardware and technology for machine learning: Section 6 - Defectivity and its impact on hardware neural networks

Published

Author(s)

Brian D. Hoskins, Matthew W. Daniels, Advait Madhavan, James A. Liddle, Jabez J. McClelland

Abstract

The current state of the art in electronics manufacturing is driven by achieving low defect rates, high levels of device-to-device uniformity, and binning integrated circuits by quality. As the industry pushes digital logic to extremes below 5 nm in transistor channel length, new lithographic methods are needed to facilitate that scaling. Extreme ultra-violet (EUV) Lithography and directed self-assembly (DSA) are among such methods, but suffer from intrinsic limitations, such as stochastic photon illumination or assembly defects, respectively. These limitations push the defect rates to above the 0.01 cm-2 densities required for semiconductor manufacturing. Enabling logic to follow memory into the backend-of-line can relax feature- size-induced manufacturing problems. At the same time, this introduces new challenges in the 3D integration, particularly if similar areal densities are required. This is especially true in systems requiring new, CMOS compatible materials which suffer from defects that would be absent in single crystal silicon.
Citation
Nanotechnology

Keywords

AI, Defectivity

Citation

Hoskins, B. , Daniels, M. , Madhavan, A. , Liddle, J. and McClelland, J. (2020), Roadmap on emerging hardware and technology for machine learning: Section 6 - Defectivity and its impact on hardware neural networks, Nanotechnology, [online], https://doi.org/10.1088/1361-6528/aba70f (Accessed May 18, 2021)
Created July 16, 2020, Updated September 25, 2020