Quantifying Interfacial Adhesion in Transfer Printing via a Cantilever Peel Test
Jiong Liu, Jun Y. Chung, Christopher Stafford
Transfer printing has been demonstrated as a fabrication method for flexible organic electronics. The transfer printing process relies on the differential adhesion of a printable layer (PL) that is pressed between two substrates: transfer substrate (TS) and device substrate (DS). Transfer of the printable layer from the transfer substrate to the device substrate requires that the adhesion of the printable layer is higher at the interface with the device substrate (interface DS/PL) than at the interface with the transfer substrate (interface TS/PL). This requirement can be satisfied by chemical treatment of the substrates, heating of thermoplastic materials, as well as kinetic control of adhesion. The present work seeks to develop an adhesion test for quantifying the adhesion at interfaces relevant to transfer printing. For this purpose, a single cantilever peel test is used to measure the adhesion energies of a model system that simulates the transfer printing process. The model system consists of a silicon (Si) wafer transfer substrate, a poly(methyl methacrylate) (PMMA) transfer layer, and a poly(ethylene terephthalate) (PET) device substrate. Appropriate specimen geometry is determined for precise estimation of the fracture energy. The fracture energy of the Si/PMMA/PET multilayer is measured as a function of surface energy of the substrates and PMMA, and the locus of failure is determined by SEM and XPS.
American Chemical Society Division of Polymeric Materials: Science and Engineering| |Proceedings of the ACS Division of Polymeric Materials: Science & Engineering |ACS
, Chung, J.
and Stafford, C.
Quantifying Interfacial Adhesion in Transfer Printing via a Cantilever Peel Test, American Chemical Society Division of Polymeric Materials: Science and Engineering| |Proceedings of the ACS Division of Polymeric Materials: Science & Engineering |ACS, New Orleans, LA, US, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=854495
(Accessed November 28, 2023)