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Peridynamic Simulation of Electromigration



David T. Read, Walter Gerstle, Stewart Silling, Vinod K. Tewary, Richard Lehoucq


A theoretical framework, based upon the peridynamic model, is presented for analytical and computational simulation of electromigration. The framework allows four coupled physical processes to be modeled simultaneously: mechanical deformation, heat transfer, electrical potential distribution, and vacancy diffusion. The dynamics of void and crack formation, and hillock and whisker growth can potentially be modeled. The framework can potentially be applied at several modeling scales: atomistic, crystallite, multiple crystallite, and macro. The conceptual simplicity of the model promises to permit many phenomena observed in microchips, including electromigration, thermo-mechanical crack formation, and fatigue crack formation, to be analyzed in a systematic and unified manner. Interfacial behavior between dissimilar crystallites and materials can also be handled in a natural way. A computational implementation of the theoretical framework is proposed, and a one-dimensional example problem is presented.
Cmc-Computers Materials & Continua


diffusion, multi-physics, multi-scale, cracks, hillocks, voids, computational simulation, metallic thin films.


Read, D. , Gerstle, W. , Silling, S. , Tewary, V. and Lehoucq, R. (2008), Peridynamic Simulation of Electromigration, Cmc-Computers Materials & Continua, [online], (Accessed March 4, 2024)
Created January 1, 2008, Updated February 19, 2017