Peel Test Revisited Using Novel High Throughput Methods

Published

February 1, 2004

Author(s)

A Chiche, Wenhua Zhang, Christopher Stafford

Abstract

We have developed a novel combinatorial method for peel testing based on the use of gradient techniques, including surface roughness and energy, adhesive or backing layer thickness, and sample annealing temperature. The experimental design provides us with a high throughput map of peel force and energy as a function of geometric and energetic parameters. These are often overlooked in peel testing, despite their importance in defining the adhesive-adherent contact and the local stress distribution, which have recently been shown as control parameters of the debonding mechanisms in tack tests. We identified and characterized the peel mechanisms relevant to a model pressure sensitive adhesive (PSA). This class of adhesives, widely used industrially, exhibits remarkable viscoelasticity and ability to sustain large deformations.

Proceedings Title

Sigma Xi Postdoctoral Poster Presentations, 2004

Conference Dates

February 19-20, 2004

Conference Location

Undefined

Pub Type

Conferences

Keywords

methods, novel, peel test, revisited, throughput

Citation

Chiche, A. , Zhang, W. and Stafford, C. (2004), Peel Test Revisited Using Novel High Throughput Methods, Sigma Xi Postdoctoral Poster Presentations, 2004, Undefined (Accessed September 16, 2024)