Chiche, A.
, Zhang, W.
and Stafford, C.
(2004),
Peel Test Revisited Using Novel High Throughput Methods, Sigma Xi Postdoctoral Poster Presentations, 2004, Undefined
(Accessed April 19, 2024)
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Peel Test Revisited Using Novel High Throughput Methods
Published
Author(s)
A Chiche, ,
Abstract
We have developed a novel combinatorial method for peel testing based on the use of gradient techniques, including surface roughness and energy, adhesive or backing layer thickness, and sample annealing temperature. The experimental design provides us with a high throughput map of peel force and energy as a function of geometric and energetic parameters. These are often overlooked in peel testing, despite their importance in defining the adhesive-adherent contact and the local stress distribution, which have recently been shown as control parameters of the debonding mechanisms in tack tests. We identified and characterized the peel mechanisms relevant to a model pressure sensitive adhesive (PSA). This class of adhesives, widely used industrially, exhibits remarkable viscoelasticity and ability to sustain large deformations.Proceedings Title
Sigma Xi Postdoctoral Poster Presentations, 2004
Conference Dates
February 19-20, 2004
Conference Location
Undefined
Pub Type
Conferences
Keywords
methods, novel, peel test, revisited, throughput
Citation
Created January 31, 2004, Updated October 12, 2021