The role of process simulation in microlithography is becoming an increasingly important part of process control as wafer feature sizes become smaller than the exposure wavelength, because the pattern transfer from photomask to wafer is nonlinear. An important factor hindering the increased use of simulation applications, however, is their inclination to be standalone applications not easily integrated into the overall process. These observations have led to the concept of The Neolithography Consortium. Neolithography is a realization and acceptance that the pattern on the photomask is not replicated exactly on the wafer because of diffraction effects, subresolution mask features and imperfections, and other effects. It is characterized by the full integration of process simulation and metrology into the IC microlithography process, leading to a comprehensive and logical approach to photomask design and wafer exposure. All of the relevant optical projection, resist exposure and development, and etch parameters, and resolution enhancement techniques, are optimized and incorporated into the photomask design before the first wafer is printed.
Proceedings of SPIE, Metrology, Inspection, and Process Control for Microlithography XIV, Neal T. Sullivan, Editor
February 28, 2000
Santa Clara, CA
Advanced Technology/Late-Breaking Developments
metrology, microlithography, neolithography, photomask, process control, process optimization, simulation
The Neolithography Consortium, Proceedings of SPIE, Metrology, Inspection, and Process Control for Microlithography XIV, Neal T. Sullivan, Editor, Santa Clara, CA
(Accessed February 25, 2024)