Boguslavsky, I.
, Bush, P.
, Kam-Lum, E.
, Kwoka, M.
, McCullen, J.
, Spalding, K.
, Vo, K.
and Williams, M.
(2021),
NEMI Tin Whisker Test Method Standards, SMTAI (Accessed November 4, 2026)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
NEMI Tin Whisker Test Method Standards
Published
Author(s)
I Boguslavsky, P Bush, E Kam-Lum, M Kwoka, J McCullen, K Spalding, K Vo,
Abstract
The need to better understand whisker growth has dramatically increased as component suppliers convert from tin-lead (SnPb) finishes to Pb-free finishes of Sn and low -alloy-content Sn-based finishes. Whiskers are spontaneous growth of metal filaments emanating from the finish surface. The issues with whiskers are they may grow long enough to cause short circuiting or break off and interfere with other devices in an application. Currently, there is not an industry-accepted test to assay the propensity of a plating finish to whisker and to estimate the risk of whisker growth for a given plating finish. The Whisker Test Method Standards Committee was formed under the sponsorship of the National Electronics Manufacturing Initiative (NEMI) to evaluate different environmental factors influencing whisker growth and to recommend test methods to assess whisker growth propensity of plating finishes.Citation
SMTAI
Pub Type
Journals
Keywords
leadframe package, Pb-free plating finish, whisker growth
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created October 12, 2021