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Microwave Packaging for Voltage Standard Applications



Mike Elsbury, Charles J. Burroughs, Paul Dresselhaus, Zoya Popovic, Samuel Benz


Improvements to the packaging of Josephson Volt- age Standard (JVS) circuits have increased operating margins, reliability, and longevity of these systems. By using the "flip- chip-on-flex" technique, reliable chip and cryoprobe mounting have been demonstrated. The microwave structures on these packages have been improved such that more power can be delivered to the JVS chip over a wider frequency range, DC to over 30GHz. Detailed finite-element simulations were per- formed to optimize the chip-to-flex launches as well as the on- flex transmission lines. It was found that coplanar waveguide transmission line designs had improved insertion and return loss compared to microstrip transmission line designs due to the large discontinuities associated with through-substrate vias for microstrip ground connections. The improved coplanar- waveguide package/probe yielded insertion loss dominated by the ∼0.25 dB/GHz cable loss and VSWR better than 2:1 for the entire 0-30GHz band. Substantially larger JVS system operating margins were measured using the CPW package, for a 5120 junction array a one-step larger than 1mA is shown 10-30GHz.
IEEE Transactions on Applied Superconductivity


Cryogenic electronics, integrated circuit packaging, Josephson arrays, Josephson device packaging, superconducting device packaging, superconducting microwave devices, superconducting integrated circuits


Elsbury, M. , Burroughs, C. , Dresselhaus, P. , Popovic, Z. and Benz, S. (2009), Microwave Packaging for Voltage Standard Applications, IEEE Transactions on Applied Superconductivity, [online], (Accessed July 23, 2024)


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Created June 2, 2009, Updated October 12, 2021