Gonzalez, E.
, Hockey, B.
and Ritter, J.
(2021),
Microstructural Development and Thermal Diffusivity of Al<sub>2</sub>O<sub>3</sub> Thin Films Prepared by a Continuous-Dip Coating Process, Journal of Materials Research
(Accessed April 4, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Microstructural Development and Thermal Diffusivity of Al2O3 Thin Films Prepared by a Continuous-Dip Coating Process
Published
Author(s)
, ,
Abstract
Films of -Al2O3, 4:m to 6:m thick, have been coated onto inconel using the continuous-dip coating technique. The as-deposited films on an Inconel 600 substrate are amorphous and exhibit a thermal diffusivity of (0.0033 0.0004) cm2@s-1, a value comparable to that of window glass. The films can be crystallized by heat-treating at 800 EC to 1000 EC for 3 h under flowing dry nitrogen gas. The thermal diffusivity of the crystalline films increased with annealing temperature. However, heat-treatment also resulted in large-scale porosity and cracks within the films which limited their thermal diffusivity to (0.0219 0.0022) cm2@s-1.Citation
Journal of Materials Research
Pub Type
Journals
Keywords
Al2O3, continuous-dip coating process, microstructure, photothermal deflection technique, Thermal Diffusivity, thin film
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created October 12, 2021