Microscale Test Technique and Test Results for Aluminum Thin Films
David T. Read, Joseph D. McColskey, Yi-Wen Cheng
A microscale, skyhook-type tensile-test technique has been developed to extend tensile testing to micrometer-scale specimens. This technique has been used to perform tenisle tests of 1 m by 10 m by 180 m gauge sections of electron-beam-evaporated aluminum films uncer both an optical and a scanning electron microscope (SEM). The technique includes three main elements: specimen design and fabrication, test apparatus including the force probe, and digital-image correlation for strain measurement. The scope of this presentation is the specimen design and the test apparatus. The specimen design has several advantages compared to previous thin-filmtest techniques, including elimination of the need to etch all the way through the substrate, applicability to narrower and more delicate specimen materials, and amenability to testing within SEM. A similar loading technique was reported by Schweitz in 1997, and a more rudimentary version was explored by Read in 1996. The results of testing aluminum thin films are presented and discussed.
Proceedings of the Society for Experimental Mechanics Annual Conference
, McColskey, J.
and Cheng, Y.
Microscale Test Technique and Test Results for Aluminum Thin Films, Proceedings of the Society for Experimental Mechanics Annual Conference, Undefined
(Accessed June 4, 2023)