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Micro-Electroplating Silver on Sharp Edges for Fabrication of Solid-State Nanopores



Brian J. Polk, Melanie Bernard, John J. Kasianowicz, Martin Misakian, Michael Gaitan


Electrodeposition of silver was investigated as a fabrication tool for infilling large (103 mm2) vias in silicon substrates. Silver reduction from ammoniacal silver nitrate was studied at electrodes of novel geometry, i.e. the edge of the vias, with respect to reduction potential, reduction pulse type, and pulse duration. A variety of crystal nucleation and growth patterns were observed and characterized by scanning electron microscopy. It was found that electroplated silver occluded the vias to leave open areas of less than 1 mm2. Such occlusions might be used as restrictions in microfluidics systems, forming a type of solid-state nanopore.
Journal of the Electrochemical Society


silver electrodeposition, silver electroplating, solid-state nanopores


Polk, B. , Bernard, M. , Kasianowicz, J. , Misakian, M. and Gaitan, M. (2004), Micro-Electroplating Silver on Sharp Edges for Fabrication of Solid-State Nanopores, Journal of the Electrochemical Society (Accessed April 20, 2024)
Created August 10, 2004, Updated October 12, 2021