Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Measurement and Modeling of Heterogeneous Chip-Scale Interconnections



Richard A. Chamberlin, Dylan F. Williams


We present precision scattering-parameter measurements of chip-to-chip connections in heterogeneous integrated circuits: indium phosphide or gallium nitride “chiplets” mounted on SiCMOS carrier chips. We demonstrate methodology, experimental results, and modeling results of these chip- scale interconnections from DC to 110 GHz. We used Thru-Reflect-Line (TRL) on-wafer calibration to establish reference planes inside heterogeneous integrated circuits and then we translated those reference planes to the proximity of the chip-to-chip transitions to isolate their contribution to the scattering parameters.
IEEE Transactions on Microwave Theory and Techniques


3-D heterogeneous integration and packaging, Thru-Reflect-Line (TRL) calibration, network analysis, indium phosphide, CMOS, gallium nitride.


Chamberlin, R. and Williams, D. (2018), Measurement and Modeling of Heterogeneous Chip-Scale Interconnections, IEEE Transactions on Microwave Theory and Techniques, [online], (Accessed December 7, 2023)
Created October 22, 2018, Updated April 15, 2019