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Mapping substrate/film adhesion with contact-resonance-frequency atomic force microscopy



Donna C. Hurley, M Kopycinski-Muller, Eric Langlois, Anthony B. Kos, N. Barbosa


We have used contact-resonance-frequency atomic force microscopy techniques to nondestructively image variations in adhesion as a buried interface. Images were acquired on a sample containing a 20nm gold (Au) blanket film on silicon (Si) with a 1 nm patterned interlayer of titanium (Ti). This design produced regions of very weak adhesion (Si/Au) and regions of strong adhesion (Si/Ti/Au). Values of the contact stiffness were 5% lower in the regions of weak adhesion. The observed behavior is consistent with theoretical predictions for layered systems with disbonds. Our results represent progress towards quantitative measurement of adhesion parameters on the nanoscale.
Applied Physics Letters


Hurley, D. , Kopycinski-Muller, M. , Langlois, E. , Kos, A. and Barbosa, N. (2006), Mapping substrate/film adhesion with contact-resonance-frequency atomic force microscopy, Applied Physics Letters, [online], (Accessed June 12, 2024)


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Created July 11, 2006, Updated October 12, 2021