Paulter, N.
(2003),
The IPC-2252, Design Guide for RF/Microwave Circuit Boards, Proceeding of the IPC Annual Meeting, Minneapolis, MN, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31393
(Accessed March 16, 2025)
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The IPC-2252, Design Guide for RF/Microwave Circuit Boards
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Author(s)
Abstract
The IPC-2252,'Design Guide for RF/Microwave Circuit Boards,'[1] (superceding the IPC-D-316) was published in July 2002. The IPC-2252 provides information pertaining to the design, fabrication, and test of printed wiring board used in high-frequency (100 MHz to 30 GHz) applications. The design topics include those describing the fabrication procedure and the circuit and board layout. Different types of board interconnects and chip mounting strategies are discussed. This document introduces the IPC-2252 and its contents. The differences between the IPC-2252 and IPC-D-316 are also discussed and a comparison to other IPC documents is provided.Proceedings Title
Proceeding of the IPC Annual Meeting
Conference Dates
September 28-October 2, 2003
Conference Location
Minneapolis, MN
Conference Title
IEEE Electrical Insulation & Dielectric Phenomena
Pub Type
Conferences
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Keywords
design guide, device mounting, electronic materials, fabrication, high-frequency, microwave circuits, radio frequency, rf circuits, printed wiring board, transmission line design
Citation
Issues
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Created September 1, 2003, Updated January 27, 2020