Keller, R.
, Monig, R.
, Volkert, C.
, Arzt, E.
, Schwaiger, R.
and Kraft, O.
(2008),
Interconnect Failure Due to Cyclic Loading, International Workshop on Stress-Induced Phenomena in Metallizations
(Accessed April 25, 2024)
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Interconnect Failure Due to Cyclic Loading
Published
Author(s)
R R. Keller, Reiner Monig, Cynthia A. Volkert, E Arzt, R Schwaiger, O Kraft
Abstract
The damage generated by AC currents at 100 Hz in interconnects has been studied andcompared with mechanical fatigue damage in thin films. The nature of the damage under the twoloading conditions is qualitatively similar, supporting the idea that the AC current damage comes from mechanical cycling due to temperature swings on the order of 100 K from Joule heating in the interconnects. In both cases, the damage forms as surface wrinkles within single grains grow in amplitude and extent with time. The possible threat to the reliability of microelectronic and micro-electromechanical systems is further escalated by the observation that soft encapsulation layers do nothing to retard the formation of the damage.Citation
International Workshop on Stress-Induced Phenomena in Metallizations
Pub Type
Journals
Keywords
cyclic deformation, electromigration, fatigue, interconnect reliability, thin film fatigue
Citation
Created October 16, 2008