Blessing, G.
, Smith, D.
, Wiederhorn, S.
and Luecke, W.
(2003),
Instrumented indentation and ultrasonic velocity techniques for the evaluation of creep cavitation in silicon nitride, Journal of Materials Science
(Accessed September 18, 2024)
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Instrumented indentation and ultrasonic velocity techniques for the evaluation of creep cavitation in silicon nitride
Published
Author(s)
, , , W E. Luecke
Abstract
Instrumented indentation and ultrasonic wave velocity techniques combined with precise density change measurements and transmission electron microscopy (TEM) were used to investigate the changes of elastic moduli in silicon nitride after tensile deformation up to 3%. Linear dependencies on strain were also found for the degradation of the indentation modulus, longitudinal and transverse ultrasonic wave velocities, Young''s, shear and bulk moduli and Poisson''s ratio. The results obtained by indentation technique and ultrasonic method were essentially identical. TEM observation confirmed that multigrain junction cavities were responsible for the density changes and the elastic moduli degradation. The density changes were linearly proportional to tensile strain with the slope of 0.75. Thus, cavitation is the dominant creep mechanism in silicon nitride studied.Citation
Journal of Materials Science
Volume
38 (7)
Pub Type
Journals
Keywords
cavitation, creep damage, elastic moduli, indentation, silicon nitride, TEM, ultrasonic wave velocity
Citation
Issues
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Created April 1, 2003, Updated February 19, 2017