Stafford, C.
, Forster, A.
, Harrison, C.
, Davis, C.
, Amis, E.
and Karim, A.
(2003),
High-Throughput Measurements of Polymer Adhesion and Mechanical Properties, Abstracts Of Papers Of The American Chemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852176
(Accessed December 14, 2024)
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High-Throughput Measurements of Polymer Adhesion and Mechanical Properties
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Abstract
Polymer adhesion is important to numerous technologies including electronic packaging, coatings and paints, biomedical implants, and pressure-sensitive adhesives. The challenge is to understand the fundamental driving forces for the development of adhesive strength at polymer - polymer, metal, ceramic, and biomaterial interfaces in multivariable environments. Current methods for characterizing adhesion with combinatorial methodologies are challenged by both experimental geometry and throughput issues. In response to this, we describe a methodology for quantitatively measuring the adhesive strength of polymer interfaces in a combinatorial manner. Likewise, we describe a simple, robust, and flexible measurement technique for the mechanical properties of thin polymer films. These combinatorial techniques are aimed to benefit the coating, semiconductor, and optical adhesives industry.Citation
Abstracts Of Papers Of The American Chemical Society
Volume
226
Pub Type
Journals
Download Paper
Keywords
adhesion mechanical properties, combinatorial methods, gradient libraries, high-throughput experimentation, polymer thin films
Citation
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Created August 31, 2003, Updated October 12, 2021