Embedded Capacitance Materials and Their Application in High Speed Designs

Published

March 1, 2003

Author(s)

T Bergstresser, R Hilburn, Jan Obrzut, K. M. Phillips

Abstract

In this paper, we review three material options for embedded capacitors: thin FR4 epoxy-glass laminate, adhesiveless copper on polyimide substrate, and unsupported epoxy filled with high dielectric constant ceramic powder. Characteristics including material components and construction, dielectric constant and loss, and topography at metal-dielectric interfaces are compared. Attention is given to frequency dependence of the different material properties. Effects of the material characteristics on electrical performance, including capacitance and power and ground plane impedance, are examined. Finally, processing and fabrication issues are discussed.

Proceedings Title

IPC Expo Technical Conference

Volume

19(8)

Conference Dates

March 23-27, 2003

Conference Location

Long Beach, CA

Conference Title

IPC Printed Circuits Expo

Pub Type

Conferences

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Keywords

coaxial discontinuity, decoupling capacitors, dielectric materials, electromagnetic simulation, embedded capacitance, embedded capacitance materials, full wave analysis, high frequency, high frequency measurements

Citation

Bergstresser, T. , Hilburn, R. , Obrzut, J. and Phillips, K. (2003), Embedded Capacitance Materials and Their Application in High Speed Designs, IPC Expo Technical Conference, Long Beach, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852216 (Accessed May 27, 2025)