Bergstresser, T.
, Hilburn, R.
, Obrzut, J.
and Phillips, K.
(2003),
Embedded Capacitance Materials and Their Application in High Speed Designs, IPC Expo Technical Conference, Long Beach, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852216
(Accessed May 2, 2025)
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Embedded Capacitance Materials and Their Application in High Speed Designs
Published
Author(s)
T Bergstresser, R Hilburn, , K. M. Phillips
Abstract
In this paper, we review three material options for embedded capacitors: thin FR4 epoxy-glass laminate, adhesiveless copper on polyimide substrate, and unsupported epoxy filled with high dielectric constant ceramic powder. Characteristics including material components and construction, dielectric constant and loss, and topography at metal-dielectric interfaces are compared. Attention is given to frequency dependence of the different material properties. Effects of the material characteristics on electrical performance, including capacitance and power and ground plane impedance, are examined. Finally, processing and fabrication issues are discussed.Proceedings Title
IPC Expo Technical Conference
Volume
19(8)
Conference Dates
March 23-27, 2003
Conference Location
Long Beach, CA
Conference Title
IPC Printed Circuits Expo
Pub Type
Conferences
Download Paper
Keywords
coaxial discontinuity, decoupling capacitors, dielectric materials, electromagnetic simulation, embedded capacitance, embedded capacitance materials, full wave analysis, high frequency, high frequency measurements
Citation
Issues
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Created February 28, 2003, Updated October 12, 2021