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The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders



Kil-Won Moon, Ursula R. Kattner, C A. Handwerker


This paper presents experimental results and theoretical calculations that evaluate the effects of Bi contamination on the solidification behavior of Sn-Pb alloys. The pasty (mushy) range, the type of solidification path, and the microstructure of the solidified alloys are described. The experimental results are obtained from thermal analysis and metallography, and the solidification calculations are performed using lever rule and Scheil assumptions. The experimental results are closer to the predictions of the lever rule calculations than those of the Scheil calculations. Although the freezing range of Bicontaminated Sn-Pb solders is increased, formation of a ternary eutectic reaction at 95 C is not observed for contamination levels below 6% of mass fraction Bi.
Journal of Electronic Materials


Bi contamination, cooling curves, pasty range, Sn-Pb solders


Moon, K. , Kattner, U. and Handwerker, C. (2008), The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders, Journal of Electronic Materials (Accessed June 25, 2024)


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Created October 16, 2008