Moon, K.
, Kattner, U.
and Handwerker, C.
(2008),
The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders, Journal of Electronic Materials
(Accessed May 1, 2025)
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The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders
Published
Author(s)
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Abstract
This paper presents experimental results and theoretical calculations that evaluate the effects of Bi contamination on the solidification behavior of Sn-Pb alloys. The pasty (mushy) range, the type of solidification path, and the microstructure of the solidified alloys are described. The experimental results are obtained from thermal analysis and metallography, and the solidification calculations are performed using lever rule and Scheil assumptions. The experimental results are closer to the predictions of the lever rule calculations than those of the Scheil calculations. Although the freezing range of Bicontaminated Sn-Pb solders is increased, formation of a ternary eutectic reaction at 95 C is not observed for contamination levels below 6% of mass fraction Bi.Citation
Journal of Electronic Materials
Pub Type
Journals
Keywords
Bi contamination, cooling curves, pasty range, Sn-Pb solders
Citation
Issues
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Created October 16, 2008